Description
Extra Information
Brand:
MOTOROLA
MPN:
XSP56001FE27
Country of Origin:
MALAYSIA
Package:
1 BOX
Type:
Ic semiconductor chip -Embedded FPGA ICs, Embedded FPGA
SPN:
XSP56001FE27
Lot of:
26
Shipping Weight:
10.00 LBS
Shipping Dimensions:
12.00
(in)
× 12.00
(in)
× 12.00
(in)
